3D IC and TSV technologies

Without the MCNC and ISPD98 benchmarks, it would arguably not have been possible for the academic community to make consistent advances in physical design over the last decade. While still being used extensively in placement and floorplanning research, those benchmarks can no longer be considered representative of tod…

Design, simulation, fabrication and measurement of two different novel flexible bow-tie antennas, a conventional and a modified bow-tie antenna with reduced metallization, are reported in this paper. The antennas are mounted on a flexible substrate fabricated at the Flexible Display Center (FDC) of Arizona State Unive…

• AHMET CEMAL DURGUN

In this study, Cu-based Mo-doped composite powder was synthesized by ball milling technique.Elemental powder mixture containing 25 wt.%Mo was milled in a high-energy planetary-type ball mill to achieve homogeneously mixed composite powder.Characterization of the starting and the milled powders was carried out using sc…

• SERKAN BIYIK

In this paper, we present improvements to recursive bisection based placement. In contrast to prior work, our horizontal cut lines are not restricted to row boundaries; this avoids a “narrow region” problem. To support these new cut line positions, a dynamic pro-gramming based legalization algorithm has been developed…

This paper discusses the implementation of a low-cost 128 times 128 uncooled infrared microbolometer detector array together with its integrated readout circuit (ROC) using a standard 0.35 mum n-well CMOS and post-CMOS MEMS processes. The detector array can be created with simple bulk-micromachining processes after th…

• TAYFUN AKIN

Crosstalk is the coupling of energy between the elements of an ultrasonic transducer array. This coupling degrades the performance of transducers in applications such as medical imaging and therapeutics. In this paper, we present an experimental demonstration of guided interface waves in capacitive micromachined ultra…

• BARIŞ BAYRAM

This paper discusses the implementation of a low-cost 128 times 128 uncooled infrared microbolometer detector array together with its integrated readout circuit (ROC) using a standard 0.35 mum n-well CMOS and post-CMOS MEMS processes. The detector array can be created with simple bulk-micromachining processes after th…

• MAHMUD YUSUF TANRIKULU

No abstract yet.

• TAYFUN AKIN

Recursive partitioning based placement has a long history, but there has been little consensus on how cut sequences should be chosen. In this paper, we present a dynamic programming approach to cut sequence generation. If certain assumptions hold, these sequences are optimal. After study of these optimal sequences, we…

In this paper we demonstrate functional 3D circuits obtained by a 3D Stacked IC approach using both Cu Through Silicon Vias (TSV) First and cost effective solution Die-to-Wafer Hybrid Collective bonding. The Cu TSV-First process is inserted between contact and M1. The top die is thinned down to 25 ¿m and bonded to the…

• ALİ MERÇ

No abstract yet.

• RECEP ÇALIN

This paper presents the design and implementation of Pirani vacuum gauges for the characterization of vacuum packaging of microelectromechanical systems (MEMS). Various Pirani vacuum gauges are fabricated with two different standard in-house fabrication processes, namely the silicon-on-glass (SOG) process and dissolve…

• TAYFUN AKIN