Makale detayı · 2017
Microstructural, mechanical, and electrical characterization of directionally solidified Al–Cu–Mg eutectic alloy
- Yıl
- 2017
- Tür
- article
Veri kaynağı ayrımı
- YÖKSİS YÖKSİS makale kaydı
- YÖKSİS dergi adı Physics of Metals and Metallography
- Katalog eşleşmesi (ISSN) Physics of Metals and Metallography
- OpenAlex OpenAlex zenginleştirmesi (özet, atıf, konular)
Özet
OpenAlex · İngilizce
The composition of an Al–Cu–Mg ternary eutectic alloy was chosen to be Al–30 wt% Cu–6 wt % Mg to have the Al2Cu and Al2CuMg solid phases within an aluminum matrix (α-Al) after its solidification from the melt. The alloy Al–30 wt % Cu–6 wt % Mg was directionally solidified at a constant temperature gradient (G = 8.55 K/mm) with different growth rates V, from 9.43 to 173.3 μm/s, by using a Bridgman-type furnace. The lamellar eutectic spacings (λE) were measured from transverse sections of the samples. The functional dependencies of lamellar spacings λE ( $${\lambda _{A{l_2}CuMg}}$$ λ A l 2 C u M g and $${\lambda _{A{l_2}Cu}}$$ λ A l 2 C u in μm), microhardness H V (in kg/mm2), tensile strength σT (in MPa), and electrical resistivity ρ (in Ω m) on the growth rate V (in μm/s) were obtained as $${\lambda _{A{l_2}CuMg}} = 3.05{V^{ - 0.31}}$$ λ A l 2 C u M g = 3.05 V − 0.31 , $${\lambda _{A{l_2}Cu}} = 6.35{V^{ - 0.35}}$$ λ A l 2 C u = 6.35 V − 0.35 , $${H_V} = 308.3{\left( V \right)^{ - 0.33}}$$ H V = 308.3 ( V ) − 0.33 ; σT= 408.6(V)0.14, and ρ = 28.82 × 10–8(V)0.11, respectively for the Al–Cu–Mg eutectic alloy. The bulk growth rates were determined as $$\lambda _{A{l_2}CuMg}^2V = 93.2$$ λ A l 2 C u M g 2 V = 93.2 and $$\lambda _{A{l_2}Cu}^2V = 195.76$$ λ A l 2 C u 2 V = 195.76 by using the measured values of $${\lambda _{A{l_2}CuMg}}$$ λ A l 2 C u M g , $${\lambda _{A{l_2}Cu}}$$ λ A l 2 C u and V. A comparison of present results was also made with the previous similar experimental results.
Konular
Atıflar
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