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akaturk Akademik ölçüm

Makale detayı · 2024

Recent developments shaping the future of antimicrobial edible food packaging: a review

Dergi

International Journal of Food Science & Technology

ISSN 0950-5423

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YÖKSİS OpenAlex Açık erişim · hybrid SJR Q1 JCR Q2 Atıf 15 Yüzdelik 82.7% FWCI 1.7
Yıl
2024
Tür
article

Veri kaynağı ayrımı

  • YÖKSİS YÖKSİS makale kaydı
  • YÖKSİS dergi adı International Journal of Food Science & Technology
  • Katalog eşleşmesi (ISSN) International Journal of Food Science and Technology
  • OpenAlex OpenAlex zenginleştirmesi (özet, atıf, konular)

Özet

OpenAlex · İngilizce

Abstract This article aimed at reviewing recent developments shaping the future of antimicrobial edible food packaging. The main issues discussed in the article are (i) factors (e.g. waste valorisation, sustainability, health and environmental concerns, religious concerns, etc.) causing emerging of alternative hydrocolloids extracted from farming/processing wastes of plants, animals, fungi, insects, snails, etc. as antimicrobial edible packaging material; (ii) emerging methods of manufacturing antimicrobial packaging (e.g. extruded and co-extruded antimicrobial casings, antimicrobial electrospun mats, and electrosprayed films, coatings and particles); (iii) emerging concepts in using natural antimicrobials in edible packaging such as using narrow- or broad-spectrum antimicrobials, synergetic mixtures, and controlled release strategies based on nanoencapsulation (e.g. Pickering emulsions, nanoemulsions, inclusion complexes, solid lipid nanoparticles and nanostructured lipid carriers). This review helps discovering the future of active edible packaging that is expected to play a central role in improving food safety and quality, human health and environmentally friendly practices.

Konular

Atıflar

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15 atıf

OpenAlex cited_by_count (önbellek / veritabanı)

Yerel katalogda bu makaleye atıf yapan 1 yayın (OpenAlex referans eşleşmesi; tam dünya listesi değildir).

  1. The principles of employing antimicrobial compounds in active packaging: Mechanisms, applications, and future directions 2026 Atıf 3 · OpenAlex

Yazarlar

  1. AHMET YEMENİCİOĞLU İZMİR YÜKSEK TEKNOLOJİ ENSTİTÜSÜ